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An In-depth Analysis Of Rudimentary Methods Of

Electronic stickers to streamline large-scale 'Internet of Things'

circuits after The researchers used one film to turn on and off an LED light display. “We’ve optimized this process so that we can delaminate electronic films from wafers in a defect-free manner,” Lee said. This technology holds a non-provisional U.S. patent. The work was supported by the Purdue Research Foundation, the Air Force Research Laboratory (AFRL-S-114-054-002), the National Science Foundation (NSF-CMMI-1728149) and the University of Virginia.  Writer: Kayla Wiles, 765-494-2432, wiles5@purdue.edu   Source: Chi Hwan Lee, 765-494-6212, lee2270@purdue.edu   Note to Journalists: For a full-text copy of the paper, please contact Kayla Wiles, Purdue News Service, at wiles5@purdue.edu . A YouTube video is available at https://youtu.be/8tNrPVi4OGg , and other multimedia can be found in a Google Drive folder at https://goo.gl/ctaYux . The materials were prepared by Erin Easterling, digital producer for the Purdue College of Engineering, 765-496-3388, easterling@purdue.edu Wafer-recyclable, environment-friendly transfer printing for large-scale thin film nanoelectronics Dae Seung Wiea1, Yue Zhangb2, Min Ku Kim1, Bongjoong Kim1, Sangwook Park3, Young-Joon Kim1, Pedro P. Irazoqui1, Xiaolin Zheng3, Baoxing Xu2, Chi Hwan Lee1 1Purdue University, West Lafayette, IN, USA 2University of Virginia, Charlottesville, VA, USA Transfer printing of thin film nanoelectronics from their fabrication wafer commonly requires chemical etching on the sacrifice of wafer, but is also limited by defects with a low yield. Here, we introduce a wafer-recyclable, environment-friendly transfer printing process that enables the wafer-scale separation of high-performance thin film nanoelectronics from their fabrication wafer in a defect-free manner that enables multiple reuses of the wafer. The interfacial delamination is enabled through a controllable cracking phenomenon in a water environment at room temperature.

For the original version including any supplementary images or video, visit https://www.purdue.edu/newsroom/releases/2018/Q3/electronic-stickers-to-streamline-large-scale-internet-of-things.html

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